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Paste (Flux ,UV,BGA,Solder,Conductive)

183°C MiJing 50g High Purity Solder Tin Paste

183°C MiJing 50g High Purity Solder Tin Paste

Category: Paste (Flux ,UV,BGA,Solder,Conductive)

Rs 1,250

Rs 1,500

Discount: 17%

Quantity

183°C MiJing 50g High Purity Solder Tin Paste Used For Mobile Phone and Electronics Repair. Melting Point: 183°C Weight: 50 grams Usage: Mobile phone motherboard, BGA chip, and SMD welding Features: Square mouth design for easy application and recycling of excess solder

  • SKU: 183°c mijing 50g high purity solder tin paste
  • Created At: 03 May 2025