Discount: 32%
217C XZZ 50g Lead Free Solder Paste. It is a Low-temperature Solder Paste Used for Repairing Electronics , Such as Mobile Phone Motherboards . The product is identified as "Lead Solder Paste" with a melting point of 217°C. The alloy is specified as Sn99Ag0.3Cu0.7, indicating a composition of 99% Tin, 0.3% Silver, and 0.7% Copper. The net weight is 50g.