Discount: 21%
SLD01 YCS Strong Magnetic Chip Positioning Tin Silicone Pad, Designed For Mobile Phone BGA chip Reballing and Soldering. Material: Very soft, high-temperature resistant silicone. Feature: Strong magnetic adsorption holds stencils and chips in place, preventing shifting. Design: Includes holes to dissipate heat during the tin planting process. Utility: Helps organize components and securely hold stencils for CPU and hard disk repairs.
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