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Paste (Flux ,UV,BGA,Solder,Conductive)

199° YCS 199C 50g Medium-Temperature Solder Paste, For Soldering Double-Layer Mobile Phone Motherboards and BGA Chip Reballing.

199° YCS 199C 50g Medium-Temperature Solder Paste, For Soldering Double-Layer Mobile Phone Motherboards and BGA Chip Reballing.

Category: Paste (Flux ,UV,BGA,Solder,Conductive)

Rs 1,150

Rs 1,550

Discount: 26%

Quantity

199° YCS 199C 50g Medium-Temperature Solder Paste, For Soldering Double-Layer Mobile Phone Motherboards and BGA Chip Reballing.

  • SKU: 199° ycs 199c 50g medium-temperature solder paste, for soldering double-layer mobile phone motherboards and bga chip reballing.
  • Created At: 15 Apr 2026