Discount: 32%
199℃ LB LB Low Temperature Solder Paste 50g Net Weight, A Lead-Free Flux Paste With A Melting Point of 199°C. For Use in The Mobile Phone Repair of Heat-sensitive PCB,CPU,IC. Brand: LB Tool (鲁斑工具), Melting Point: 199°C (low temperature). Net Content: 50g. Application: Widely used for BGA (Ball Grid Array) tin planting when repairing mobile phones, computers, and other electronic products not resistant to high temperatures. Properties: Features moderate viscosity, no collapse or deviation, and provides bright, full solder joints.
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