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BGA REBALLING STENCILS +MAGNETIC PLATFORM

BG01 2UUL ABCD Reballing Stencil For iPh 8-16PM (4pcs/pack)

BG01 2UUL ABCD Reballing Stencil For iPh 8-16PM (4pcs/pack)

Category: BGA REBALLING STENCILS +MAGNETIC PLATFORM

Rs 2,100

Rs 2,700

Discount: 22%

Quantity

BG01 2UUL ABCD Reballing Stencil For iPh 8-16PM (4pcs/pack) which are used for professional iPhone motherboard and IC repairs. Product Name: 2UUL BG01 ABCD Reballing Stencil Kit for iPhone 8 to 16 Pro Max. Material: Made from durable, heat-resistant stainless steel. Purpose: The kit includes four stencils (A, B, C, and D) designed for specific components like the CPU, NAND flash, baseband IC, Wi-Fi IC, and various other small chips. Compatibility: Designed to fit a wide range of iPhone models, from the 8 series up to the 16 PM series.

  • SKU: bg01 2uul abcd reballing stencil for iph 8-16pm (4pcs/pack)
  • Created At: 28 Nov 2025