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BGA REBALLING STENCILS +MAGNETIC PLATFORM

C6 XZZ Samsung S21-S25 Ultra Magnetic Universal Base With  Mid-Layer Tin Planting Tables and Steel Meshes.

C6 XZZ Samsung S21-S25 Ultra Magnetic Universal Base With Mid-Layer Tin Planting Tables and Steel Meshes.

Category: BGA REBALLING STENCILS +MAGNETIC PLATFORM

Rs 21,000

Quantity

C6 XZZ Samsung S21-S25 Ultra Magnetic Universal Base With Mid-Layer Tin Planting Tables and Steel Meshes. Purpose: These tools are used for reballing or re-tinning the BGA components (like ICs) on the mid-layer of phone motherboards during repair. Components: The set includes a universal magnetic base, model-specific tin planting tables (stencils), and corresponding steel meshes for precise application of solder paste or balls. Compatibility: Each tin planting table and steel mesh is designed for a specific Samsung Galaxy Ultra model (S21, S22, S23, S24, S25).

  • SKU: c6 xzz samsung s21-s25 ultra magnetic universal base with mid-layer tin planting tables and steel meshes.
  • Created At: 12 Sep 2025