DA28 2UUL FlatCut Solder Pad Underfill Glue Fast Removal Blades. These blades are designed for mobile phone repair, specifically for removing residual glue and solder pads on circuit boards and mobile phone CPU PCBs without damaging the components. Product: 2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades. Purpose: Used for cleaning and removing underfill glue and solder pads on mobile phone PCBs and ICs. Features: Designed for fast removal, hand-polished, made of high-quality steel. Packaging: Typically sold in boxes containing multiple blades (e.g., 5 pieces per box).
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