K23 Max Mijing Multi-functional Repair Fixture ,For IC Fixed Tinning Clean Holder For Mobile Phone Motherboard Logic Board BGA Soldering Repair Specifically Phone Motherboards. Key features of the Mijing K23 Max include: Dual-axis and three-position design: Allows for securing two motherboards simultaneously. Adjustable clamps: Provide a firm grip on the motherboard, preventing movement during repairs. High-temperature resistance: Constructed from materials that can withstand high temperatures encountered during soldering. Multi-functional areas: Include chip storage slots, a CPU de-gluing area, and a chip fixing area. Compatibility: Suitable for a wide range of devices, including iPhones (A9-A16 chips) and other mobile phone models. Ergonomic design: Features an ergonomic handle for comfortable use during extended repair sessions. Stable base: The optimized steel bottom ensures a stable platform for soldering operations.