LW-HS3 LUOWEI Universal Preheating Platform For Phone PCB Board IC Chips Layering Tin Planting Degumming Heating Table. Function: The HS3 preheating station is a professional tool for working with sensitive electronic components. It is used for tasks such as motherboard layering, lamination, tinning, BGA chip degumming, and glue removal. It eliminates the need for hot air guns or soldering irons for these specific applications, providing safer, more even heating. Precise Temperature Control: It features a temperature control system with a range of 80–260 degrees Celsius (176–500 degrees Fahrenheit). The device status is indicated by a light that changes color: green for stopped heating, red for heating to the preset temperature, and yellow for constant temperature maintenance. Design & Portability: Made from aviation aluminum alloy, the platform is compact, portable, and energy-efficient. It has a heating area of 65mm x 100mm, suitable for various smartphone motherboard sizes, and uses PD (Power Delivery) input for rapid heating up to 99W.