M29 JTX iPhone X-17 Series Mid-Layers BGA Reballing Stencil Tin Planting Platform.

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CPU & Layyer Reballing Platform

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M29 JTX iPhone X-17 Series Mid-Layers BGA Reballing Stencil Tin Planting Platform.

Category: CPU & Layyer Reballing Platform

Rs 17,500

Rs 21,000

Discount: 17%

M29 JTX iPhone X-17 Series Mid-Layers BGA Reballing Stencil Tin Planting Platform Used For Repairing Mobile Phone Motherboards. Purpose: Specifically designed for BGA (Ball Grid Array) reballing and chip soldering on smartphone motherboards. Compatibility: Supports the iPhone X through iPhone 17 Pro Max series. Features: Includes magnetic positioning and high-temperature resistant plates for accurate tin planting.