Discount: 11%
MS38 MECHANIC 50g 138C injection Solder Paste, Lead Free Low Temperature ,For Mobile Phone IC CPU BGA SMD Phone Repair Paste. It is a lead-free, low-temperature paste with a melting point of \(138^{\circ }\text{C}\). The package includes a plunger and two needles for precise dispensing. It is specifically designed for rework involving Ball Grid Arrays (BGA) and Surface Mount Devices (SMD). The product composition includes a mixture of high-quality alloyed powder and flux.
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