Discount: 27%
M.Y-005 MR.YANG Magnetic Tin Planting Silicone Pad, For Mobile Phone and Electronics BGA IC reballing. Magnetic Adsorption: It uses strong magnets to securely hold steel stencils in place, preventing them from shifting while you apply solder paste.Heat Resistance: Made from high-temperature silicone, it can withstand the heat from a hot air gun without deforming or releasing toxic fumes.Precise Slots: The labels (0.45, 0.75, 0.55, 0.35) correspond to specific chip or slot sizes common in mobile phone motherboard repairs.Heat Dissipation: The design helps distribute heat evenly to prevent chips from "bulging" or being damaged by localized overheating during the soldering process.
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