Discount: 21%
M.Y-XJ01 MR.YANG 183°C iC Reballing Solder Paste For Mobile Phone,Laptop PCB, BGA, CPU, SMD High Quality iC Reballing Solder Paste. Type: Solder paste, a mixture of granulated alloy powder and flux. Melting Point: The label indicates a melting point. Use: Essential for surface mount technology (SMT) to create reliable electrical connections. Residue: Often uses Rosin Mildly Activated (RMA) flux, which can be non-corrosive and non-conductive, allowing for a "no-clean" process.
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