Discount: 28%
QLM:3 FMT Snapdragon Steel Original BGA Reballing Stencil For Snapdragon SM8250, SM8350, SM8450, SM8475/8425, SM8550, SM8150, SM7450, SM7475, SM7550,RAM 556 These stencils are steel mesh templates with precise hole patterns matching the ball grid array (BGA) layout of specific integrated circuits (ICs). They are used by technicians to apply solder paste or balls to the IC pads when reattaching a chip to a mobile phone's mainboard. The stencils shown are compatible with a range of Qualcomm Snapdragon processors, including the Snapdragon 888 (SM8350), Snapdragon 8Gen2 (SM8550), and Snapdragon 8Gen1 (SM8450).
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