Discount: 23%
S21 XZZ L2023 Intelligent Heating Platform Modules, Designed Specifically For Samsung Smartphone Repair. Function: Used for motherboard middle layer tin planting, reballing, and CPU desoldering. Compatibility: Supports various Samsung Galaxy models including the S21, S22, S23, S24, and S25 series, as well as Z Fold and Z Flip devices. Features: Features a strong magnetic adsorption function to tightly connect the steel mesh to the heating table for precise positioning. Usage: These modules are part of a larger desoldering station setup to aid in efficient and safe phone repairs.
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