بِسْمِ ٱللَّٰهِ ٱلرَّحْمَٰنِ ٱلرَّحِيمِ
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UG-183 UGAIN 183C 6Og BGA Reballing Great Solder Paste. Melting Point: 138C Composition: Contains Tin (Sn) and Bismuth (Bi) alloy (Sn63Bi37) Weight:60g
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