Discount: 17%
WL HT007 iPhone 13 ,13PM 2in1 Layered Heating Module, A Extended Module For Motherboard Repair Stations. Purpose: Designed for desoldering, separation, and reballing of iPhone 13 motherboards. Compatibility: Supports iPhone 13,13PM models. Technology: Uses precision heating to distribute heat evenly, preventing damage to delicate IC components during repair. Features: Includes four distinct modular molds for different phone models and a specialized connection cable.
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