WL HT007 iPhone 14 Series 4in1 Layered Heating Module.

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Motherboard Tester & Heating Platform

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WL HT007 iPhone 14 Series 4in1 Layered Heating Module.

Category: Motherboard Tester & Heating Platform

Rs 12,500

Rs 15,000

Discount: 17%

WL HT007 iPhone 14 Series 4in1 Layered Heating Module, A Extended Module For Motherboard Repair Stations. Purpose: Designed for desoldering, separation, and reballing of iPhone 14 motherboards. Compatibility: Supports iPhone 14,14plus,14P,14PM models. Technology: Uses precision heating to distribute heat evenly, preventing damage to delicate IC components during repair. Features: Includes four distinct modular molds for different phone models and a specialized connection cable.