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BGA-Fulx Paste&Camical

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XGSP50 MECHANIC 183°C 42g BGA Solder Paste

PKR 650

Availability: In Stock

Quantity

MECHANIC XGSP50 42G 183℃ Solder Paste Melting Point 183℃ Flux IPX3 25-45um For BGA CPU Chip Ball Planting.

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