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BGA REBALLING STENCILS +MAGNETIC PLATFORM

YCS 01 Snapdragon CPU Power ic BGA Reballing Stencil

YCS 01 Snapdragon CPU Power ic BGA Reballing Stencil

Category: BGA REBALLING STENCILS +MAGNETIC PLATFORM

Rs 600

Quantity

YCS 01 Snapdragon 855, 730, 845, SM8150, 7150, and SDM845 BGA Reballing Stencil

  • SKU: ycs 01 snapdragon cpu power ic bga reballing stencil
  • Created At: 16 Feb 2025