Discount: 29%
YCS EMMC/EMCP/NAND Hard Disk BGA Reballing Stencil. YCS Hardisk Tin Planting Network Repair Tool, which is a stencil used in mobile phone repair, specifically for reballing BGA (Ball Grid Array) chips. It assists in accurately placing solder balls on integrated circuits. Key details include: It is used for repairing and reballing chips on mobile phone motherboards. The stencil has various patterns with different numbers of balls (e.g., 169, 153, 162, etc.) to match different chip sizes and configurations.
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