YCS iPhone (A8-A18) BGA Reballing Stencil Magnetic Platform.Designed For Repairing and Reballing Various CPU ICs in iPhones (A8-A18), Purpose: This set is used for temporary IC planting, a crucial step in repairing or replacing CPU and other ICs in mobile devices. Components: It typically includes various steel mesh stencils (labeled A8-A17 in the image), a tin planting platform, and potentially other tools for BGA reballing. Compatibility: The set is designed for a wide range of mobile devices and CPU types, offering versatility for repair technicians.
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