بِسْمِ ٱللَّٰهِ ٱلرَّحْمَٰنِ ٱلرَّحِيمِ
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183° YCS 183C 50g Medium-Temperature Solder Paste, For Soldering Double-Layer Mobile Phone Motherboards and BGA Chip Reballing.
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السَّلَامُ عَلَيْكُمْ وَرَحْمَةُ اللهِ وَبَرَكَاتُهُ
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