Discount: 21%
GW50 MECHANIC 217C 50g New Upgraded BGA Reballing Solder Paste, For PCB CPU IC Chip Welding Usage: Designed for BGA (Ball Grid Array) tin planting, CPU repair, and IC maintenance on motherboards. Melting Point: High-temperature formula melting at (217C). Features: Provides bright, full solder joints with high oxidation resistance. Weight: Generally available in 50g containers.
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