بِسْمِ ٱللَّٰهِ ٱلرَّحْمَٰنِ ٱلرَّحِيمِ
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UG-217 UGAIN 217C 6Og BGA Reballing Great Solder Paste. Melting Point: 217C Composition: Contains Tin (Sn) and Bismuth (Bi) alloy (Sn99Ag0.3Cu0.7) Weight:60g
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السَّلَامُ عَلَيْكُمْ وَرَحْمَةُ اللهِ وَبَرَكَاتُهُ
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