183°C 50g MiJing High Purity Tin Paste

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BGA-FLUX-NANO SOLDER PASTE

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183°C 50g MiJing High Purity Tin Paste

Category: BGA-FLUX-NANO SOLDER PASTE

Rs 1,250

Rs 1,500

Discount: 17%

183°C 50g MiJing High Purity Tin Paste, a soldering material used for electronics repair, specifically for mobile phones, SMD, BGA, IC, and PCB welding. Key features include: Material: High-purity tin paste. Melting Point: 183°C. Usage: Facilitates easier maintenance and efficient soldering. Design: User-friendly packaging for easy application and minimal waste. Packaging: 50g. Origin: Made in China.