Discount: 31%
199C XZZ 50g Lead Free Solder Paste. It is a Low-temperature Solder Paste Used for Repairing Electronics , Such as Mobile Phone Motherboards . Melting Point: 199°C Composition: Sn/Pb/Ag0.3, indicating a leaded solder with a small amount of silver. Net Weight: 50g Particle Size (Microns): 20-38um Common Applications: High-precision circuit board SMT soldering, BGA welding, and mobile device repair.
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