Discount: 33%
BG-010 BG TOOLS Universal High Quality Magnetic Tin Planting Silicone Pad Designed For Mobile Phone CPU IC Repair Pad. Magnetic Surface: Features strong magnetic adsorption to securely hold small metal components, BGA stencils, and screws in place during repairs.Heat Resistance: Made from high-grade silicone capable of withstanding temperatures typical of hot air rework stations and soldering irons.Specialized Grooves: Includes specific slots designed for positioning CPU, NAND, and other IC chips, with markers indicating different thicknesses such as 0.4mm, 0.5mm, and 0.8mm.Non-Slip Design: The material is designed to be anti-slip, non-stick, and easy to clean, making it simple to remove flux, glue, or solder residue.
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