Discount: 28%
IPU:1 FMT iPhone (11-17PM) Steel Original BGA Reballing Stencil For A13, A14, A15, A16, A17, A18, A18PRO, A19, A19PRO, BGA110, BGA315, WiFi. It is a multi-function, "superhard" steel mesh stencil used for mobile phone motherboard repair, specifically for reballing integrated circuits (ICs). The stencil is compatible with various Apple components, including A13 to A19Pro CPUs, different generations of baseband chips (modems), and WiFi modules. It is manufactured by Amaoe and has a thickness of 0.12mm, as indicated by the text "T=0.12MM". The product is available from the FMT Online Store, which specializes in mobile phone repairing tools.
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