Discount: 39%
P08 LanRui Explosion-Proof Solder Gasket, a Tool Used in Mobile Phone and Electronics Repair. Function: Prevents "tin explosion" or solder ball splashing during BGA reballing processes by keeping the steel mesh flat. Material: Made from high-temperature resistant, ultra-clear glass. Ease of Use: Simplifies the reballing process, ensuring even solder application. Application: Primarily used for phone BGA repair and motherboard soldering.
Only Online Sale Mobile Repairing Tools
