QU:4 AMAOE BGA Reballing Stencil For CPU MSM8994, MSM8974, and MSM8960.

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IC Reballing Stencil

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QU:4 AMAOE BGA Reballing Stencil For CPU MSM8994, MSM8974, and MSM8960.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:4 AMAOE BGA Reballing Stencil For CPU MSM8994, MSM8974, and MSM8960. Function: Used for reballing (re-applying solder balls to) Qualcomm CPU chips, specifically models MSM8994, MSM8974, and MSM8960. Material and Design: Made of high-quality alloy steel with a super-hard design, featuring heat dissipation holes to prevent bubbling during the repair process. Thickness: The stencil has a precision thickness of 0.12mm. Usage: Designed for professional mobile phone repair maintenance.