QU:8 AMAOE BGA Reballing Stencil For CPU SM8250, SM8350, SDM439, and Snapdragon 888 series chips.

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IC Reballing Stencil

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QU:8 AMAOE BGA Reballing Stencil For CPU SM8250, SM8350, SDM439, and Snapdragon 888 series chips.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:8 AMAOE BGA Reballing Stencil For CPU SM8250, SM8350, SDM439, and Snapdragon 888 series chips. Model: Amaoe QU8. Compatibility: Supports Qualcomm SM8250, SM8350, SDM439, and Snapdragon 888 series chips. Specifications: Made of Japanese steel, 0.12mm thickness, and features square hole designs for solder ball planting. Feature: Includes a "heat hole anti-bulge design" to prevent warping during high-temperature soldering.