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IC Reballing Stencil

QU:1 AMAOE BGA Reballing Stencil For CPU MSM8996,MSM8976,MSM8992.

QU:1 AMAOE BGA Reballing Stencil For CPU MSM8996,MSM8976,MSM8992.

Category: IC Reballing Stencil

Rs 600

Rs 700

Discount: 14%

Quantity

QU:1 AMAOE BGA Reballing Stencil For MSM8996,MSM8976,MSM8992. Model Number: QU1. Compatibility: Supports Qualcomm CPU models including MSM8996, MSM8976, and MSM8992. Material: Made of durable alloy steel for high-temperature resistance. Features: Features a 0.12mm thickness and includes cooling holes to prevent bubbling during the solder tin planting process.

  • SKU: qu:1 amaoe bga reballing stencil for cpu msm8996,msm8976,msm8992.
  • Created At: 21 Feb 2026