Discount: 20%
QU:2 AMAOE BGA Reballing Stencil For CPU MSM8953-B01 MSM8953-1AB MSM8937 MSM8998 MSM8916. Model/Compatibility: Specifically designed for Qualcomm CPU chipsets including MSM8953, MSM8937, MSM8998, and MSM8916. Material and Design: Crafted from high-quality stainless steel with a heat-resistant design up to 105℃, ensuring durability for reballing technicians. Technology: Features a 0.12mm thickness with a specialized "heat hole" anti-bulging design for precise tin planting. Application: Used for chip-level repair to accurately reattach solder balls to CPU pins.
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