QU:6 AMAOE BGA Reballing Stencil For CPU QSC6270, MDM9600, MSM6230, MSM7227, QSC1110, MDM6600, MSM3246, MSM8909W, QSC1105, MDM8215, MDM9215M, and MSM7521.

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IC Reballing Stencil

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QU:6 AMAOE BGA Reballing Stencil For CPU QSC6270, MDM9600, MSM6230, MSM7227, QSC1110, MDM6600, MSM3246, MSM8909W, QSC1105, MDM8215, MDM9215M, and MSM7521.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:6 AMAOE BGA Reballing Stencil For CPU QSC6270, MDM9600, MSM6230, MSM7227, QSC1110, MDM6600, MSM3246, MSM8909W, QSC1105, MDM8215, MDM9215M, and MSM7521. Function: Used for BGA (Ball Grid Array) reballing on mobile phone circuit boards to repair or replace chips. Compatibility: Designed for Qualcomm chips including QSC6270, MDM9600, MSM6230, MSM7227, QSC1110, MDM6600, MSM3246, MSM8909W, QSC1105, MDM8215, MDM9215M, and MSM7521. Material: Steel stencil. Thickness: 0.12MM.

SKU: qu:6 amaoe bga reballing stencil for cpu qsc6270, mdm9600, msm6230, msm7227, qsc1110, mdm6600, msm3246, msm8909w, qsc1105, mdm8215, mdm9215m, and msm7521.
Created At: 25 Oct 2023

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