QU:7 AMAOE BGA Reballing Stencil For CPU SM4250, SM6125, SM6115, SM7125, SM7150, SM7225, and SM7350. .

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IC Reballing Stencil

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QU:7 AMAOE BGA Reballing Stencil For CPU SM4250, SM6125, SM6115, SM7125, SM7150, SM7225, and SM7350. .

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:7 AMAOE BGA Reballing Stencil For CPU SM4250, SM6125, SM6115, SM7125, SM7150, SM7225, and SM7350. . Compatibility: Designed for reballing various Qualcomm Snapdragon CPU models including SM4250, SM6125, SM6115, SM7125, SM7150, SM7225, and SM7350. Specifications: It is part of the "Superhard" series with a thickness of 0.12mm. Features: The stencil features a heat hole design intended to prevent bulging during the soldering process. Purpose: Used as a direct heat template for precise tin plating on IC chips during hardware repairs.