Discount: 20%
MQ:5 AMAOE BGA Reballing Stencil For CPU MT6895Z/8795Z, MT6983Z, MT8176V, SM8475, SM6225, SM7450, SM8550, and RAM496. Product: AMAOE MQ5 BGA Stencil for Qualcomm and MediaTek CPUs. Purpose: Designed for precision reballing of BGA (Ball Grid Array) IC chips using heat. Features: It is 0.12mm thick and constructed from high-quality, deformation-resistant material with specific heat dissipation holes to prevent bulging. Compatibility: Supports multiple chip models including MT6895Z/8795Z, MT6983Z, MT8176V, SM8475, SM6225, SM7450, SM8550, and RAM496.
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