Discount: 20%
MQ:6 AMAOE BGA Reballing Stencil For CPU SM6450, SM8650, SM4450) and MediaTek (MT6985W, MT6781V, MT6879V, MT8781V) Supported Chips: Designed for Qualcomm Snapdragon (SM6450, SM8650, SM4450) and MediaTek (MT6985W, MT6781V, MT6879V, MT8781V) CPUs. Specifications: Made of high-quality stainless steel with a thickness of 0.12mm. Features: Features a heat-resistant design to withstand high temperatures during the reballing process and cooling holes to prevent bulging. Purpose: Used by technicians to accurately place solder balls on BGA (Ball Grid Array) chips during phone maintenance.
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