MQ:3 AMAOE BGA Reballing Stencil For CPU SM8250, SM7250, SM6125, SM7150, and MTK MT6885ZA&B.

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IC Reballing Stencil

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MQ:3 AMAOE BGA Reballing Stencil For CPU SM8250, SM7250, SM6125, SM7150, and MTK MT6885ZA&B.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

MQ:3 AMAOE BGA Reballing Stencil For CPU SM8250, SM7250, SM6125, SM7150, and MTK MT6885ZA&B. Purpose: Used to restore solder balls on IC chips during mobile logic board repairs. Compatibility: Supports various chip models including Qualcomm SM8250, SM7250, SM6125, SM7150, and MTK MT6885ZA&B. Features: Features a 0.12mm thickness, precise pin locations, and a heat-hole design to prevent bulging. Material: Constructed from deformation-resistant material for laser-cut precision.