QU:3 AMAOE BGA Reballing Stencil For CPU SDM660, MSM8612, MSM8952, MSM8909, MSM8940, MSM8928, and MSM7225A.

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IC Reballing Stencil

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QU:3 AMAOE BGA Reballing Stencil For CPU SDM660, MSM8612, MSM8952, MSM8909, MSM8940, MSM8928, and MSM7225A.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:3 AMAOE BGA Reballing Stencil For CPU SDM660, MSM8612, MSM8952, MSM8909, MSM8940, MSM8928, and MSM7225A. Chip Compatibility: Specifically designed for SDM660, MSM8612, MSM8952, MSM8909, MSM8940, MSM8928, and MSM7225A. Material: Made from a "Superhard" alloy for durability. Thickness: 0.12mm thin, ideal for precise soldering. Design Features: Features heat dissipation holes designed to prevent bulging during the reballing process.