RL-402 RELIFE 183C 40g Solder Paste , Used For Electronics Repair , Particularly For Chips And Circuit Boards. Composition: Sn63/Pb37 alloy. Melting point: 183°C. Viscosity: 160-230 Pa.s. Particle size: 20-38µm. Features: Good adhesion and wettability. Strong welding ability. Residue is minimal and no cleaning is required.
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