RL-402 RELIFE 183°C 40g Reballing Solder Paste

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BGA-FLUX-NANO SOLDER PASTE

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RL-402 RELIFE 183°C 40g Reballing Solder Paste

Category: BGA-FLUX-NANO SOLDER PASTE

Rs 850

Rs 1,100

Discount: 23%

RL-402 RELIFE 183C 40g Solder Paste , Used For Electronics Repair , Particularly For Chips And Circuit Boards. Composition: Sn63/Pb37 alloy. Melting point: 183°C. Viscosity: 160-230 Pa.s. Particle size: 20-38µm. Features: Good adhesion and wettability. Strong welding ability. Residue is minimal and no cleaning is required.