QU:5 AMAOE BGA Reballing Stencil For CPU SDM845, SM8150, SDM670, SDM710, MSM8917, and SM6150.

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IC Reballing Stencil

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QU:5 AMAOE BGA Reballing Stencil For CPU SDM845, SM8150, SDM670, SDM710, MSM8917, and SM6150.

Category: IC Reballing Stencil

Rs 600

Rs 750

Discount: 20%

QU:5 AMAOE BGA Reballing Stencil For CPU SDM845, SM8150, SDM670, SDM710, MSM8917, and SM6150. Function: Used for reapplying solder balls to Qualcomm CPUs and RAM chips during rework and repair. Compatibility: Designed for several Qualcomm chipset models, including SDM845, SM8150, SDM670, SDM710, MSM8917, and SM6150. Material & Design: Made from a super-hard material with hole" design to prevent buckling. Brand: Amaoe.